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EPON™ Resin 872-X-75 is a 75% by weight solution of EPON 872 in xylene. EPON 872 is a chemically-modified BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 872-X-75 can be combined with other EPON Resins, HELOXY™ Modifiers, or used as the sole resin to provide varying degrees of flexibility and toughness. EPON Resin 872-X-75 can be used with most curing agent types. EPON Resin 872-X-75 provides cured resin toughness and flexibility in comparison to liquid grade BPA epoxies, but reduces elevated temperature performance. EPON Resin 872-X-75 is especially useful in applications requiring extra thermal shock or impact resistance.
Property | Standard | Value | Unit | Test Method |
---|---|---|---|---|
Color | 6 max. | Gardner | ASTM D1544 | |
Epoxide Equivalent Weight | 625 - 700 | g/eq | ASTM D1652 | |
Solids | 74 - 76 | % by Weight | SRC 09Q16 | |
Viscosity at 25°C ¹ | 20 - 28 | P | ASTM D445 |
1 75% solution in xylene
Property | Standard | Value | Unit | Test Method |
---|---|---|---|---|
Density of E872 Solids at 25°C ¹ | 9.0 | lb/gal | ASTM D1475 | |
Solution Density at 25°C ¹ | 8.4 | lb/gal | ASTM D1475 |