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Epoxy Resin Systems for Adhesives

Our epoxy systems offer a wide range of processing and performance characteristics for formulating adhesives that bond metals, concrete, ceramics, glass, plastics, cloth, paper, polyesters or thermoplastic rubber. Our epoxy resin/modifier/curing-agent systems are available in high solids, waterborne and solvent-borne formats and with the following features:

Excellent chemical resistance
Excellent water resistance
Excellent performance at extremes of temperature
Rapid- and low-temperature cure
Strong bonding to many substrates

We provide proven, technologically advanced solutions for aerospace bonding.

High performance systems enable adhesive applications such as rubber-to-metal, screw fastening, hem flanges and adhesion promotion in PVC plastisols.

Chemical Anchoring

Our epoxy or vinyl ester resin-based systems for adhesives that bond metal to a solid substrate can deliver cured systems stronger than the substrate.

Construction and Infrastructure

Westlake epoxy offers resins for adhesives that bond concrete to concrete, metal or other substrates.

Composites and Electronics

These highly specialized systems for composite-to-composite bonding and electronics assembly (e.g. chip adhesives) are easily applied and durable.

Bond many substrates and deliver a variety of pot lives and cure times.

Our resins for general purpose adhesives that can bond together a variety of substrates at a reasonable cost and these systems are provided with helpful technical assistance, if desired.

Our resins for adhesives to bond glass or thermoplastics can optimize a variety of performance properties such as faster, lower temperature cure or improved heat resistance.

A variety of epoxy resins and curing agents are suitable for food grade and other packaging adhesives.