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Solid Epoxy Resin Solutions

EPON™ Resins in the 1001-series are BPA epoxy solutions. With solids contents ranging from 65-80% weight non-volatiles in a variety of solvents, these solutions offer a wide range of viscosities and evaporation rates. These resins are ideal for a range of coating, construction, adhesive, electrical casting and electrical laminate applications requiring:

Excellent chemical resistance
Excellent corrosion resistance
Excellent water resistanceLow color
Ambient cure

EPON Resins 1004 to 1009 are medium to higher molecular weight epoxy resins supplied in a variety of solvent blends that offer a balance of lower viscosity and evaporation rates. These resin solutions are ideal for:

Coil coatings
General metal coatings
Baking temperature cure

Solid Epoxy Resin Solutions (E1001 resin solutions)

Product	Typical Properties			Description	Application
Product	Resin Type	Viscocity at 25^oC, P	WPE, g./eq.	Description	Coatings	Construction	Composites	All Others⁽¹⁾
EPON Resin 1001-A-80	BPA epoxy solution	27 - 148	450 – 550	Low mol. weight solid epoxy resin at 80% wt. solids in acetone (VOC exempt)
EPON Resin 1001-B-80	BPA epoxy solution	27 - 148	450 – 550	Low mol. weight solid epoxy resin at 80% wt. solids in MEK
EPON Resin 1001-CX-75	BPA epoxy solution	27 - 148	450 – 550	Low mol. weight solid epoxy resin at 75% solids in MIBK / xylene
EPON Resin 1001-G-70	BPA epoxy solution	36 – 99	450 – 500	Low mol. weight solid epoxy resin at 75% solids in n-butyl acetate
EPON Resin 1001-H-75	BPA epoxy solution	36 – 388	450 – 600	Low mol. weight solid epoxy resin at 75% solids in propylene glycol monomethyl ether
EPON Resin 1001-K-65	BPA epoxy solution	10 – 50	450 – 550	Low mol. weight solid epoxy resin at 65% solids in t-butyl acetate (VOC exempt)
EPON Resin 1001-O-75	BPA epoxy solution	27 – 148	450 – 550	Low mol. weight solid epoxy resin at 75% solids in MNAK
EPON Resin 1001-T-75	BPA epoxy solution	36 – 388	450 – 550	Low mol. weight solid epoxy resin at 75% solids in toluene
EPON Resin 1001-UY-70	BPA epoxy solution	36 – 64	450 – 500	Low mol. weight solid epoxy resin at 70% solids in aromatic 100 / ethylene glycol monopropyl ether
EPON Resin 1001-X-75	BPA epoxy solution	36 – 388	450 – 500	Low mol. weight solid epoxy resin at 75% solids in xylene

HIGHLY RECOMMENDED:

Solid Epoxy Resin Solutions (higher molecular weight resins)

Product	Typical Properties			Description	Application
Product	Resin Type	Viscocity at 25^oC, P	WPE, g./eq.	Description	Coatings	Construction	Composites	All Others⁽¹⁾
EPON Resin 1004-O-65	BPA epoxy solution	23 – 99	850 – 1050	Resin solution, 65% solids in MNAK
EPON Resin 8521-MX-60	BPA epoxy solution	17.5–36	750 – 850	Modified resin solution, 60% wt. solids in ethylene glycol monobutyl ether / xylene
EPON Resin 1007-CT-55	BPA epoxy solution	23 – 64	1600-2300	Resin solution, 55% solids in MIBK / toluene
EPON Resin 1007-FMU-50	BPA epoxy solution	27 – 64	1600-2300	Resin solution, 50% solids in n-butanol / ethylene glycol monobutyl ether / aromatic 100
EPON Resin 1009-DU-40	BPA epoxy solution	11 – 27	2300-3500	Resin solution, 40% solids in diacetone alcohol / aromatic 10
EPON Resin 1009-MX-40	BPA epoxy solution	6 – 23	2300-3000	Resin solution, 40% solids in ethylene glycol monobutyl ether / xylene

HIGHLY RECOMMENDED:

¹ Other applications include adhesives, electrical castings, electrical laminates and fibers
² 75% by weight solution in xylene

For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.