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Powder Coating and Molding Epoxy Resins, and Electrical Grade Epoxy Resins

Westlake Epoxy offers a variety of resins for powder coating and molding for:

The EPON™ Resin 2000 series of epoxy powder coating and molding resins includes difunctional and multifunctional BPA based resins with melting points ranging from 80°C to 120°C and melt viscosities at 150°C from 20 to 600 Poise. In powder coating applications, these resins are typically preferred for higher melt viscosities and higher film thicknesses.

We also offer the EPON Resin 3000 series of solid resins with characteristics for electrical encapsulation including:

Low chloride
Sinter resistance
Good reactivity
Excellent wet-out

Product	Typical Properties			Description	Application
Product	WPE, g./eq.	Viscocity at 25^oC, cP⁽¹⁾	Melt Point, ^oC	Description	Coatings	Construction	Composites	All Others⁽²⁾
EPON Resin 2002	675 - 760	10 - 17	80 - 90	Medium molecular weight solid BPA epoxy resin
EPON Resin 2003	725 - 825	14 - 18	90 - 95	Medium molecular weight solid BPA epoxy resin
EPON Resin 2004	875 - 975	18 - 27	95 - 105	Medium molecular weight solid BPA epoxy resin
EPON Resin 2005	1200 - 1400	26 - 55	110 - 120	Moderately high molecular weight solid BPA epoxy resin
EPON Resin 2014	750 - 850	35 - 75	100 - 120	Multifunctional resin for improved chemical resistance
EPON Resin 2024	850 - 950	17 - 26	95 - 105	Medium molecular weight BPA based resin formulated with a flow control agent
EPON Resin 3002	520 - 590	7.4 - 9.5	75 - 80	Low chloride, sinter resistant grade for electrical applications

HIGHLY RECOMMENDED:

¹ 40% wt. solution in methyl ethyl ketone
² Other applications include adhesives, electrical castings, electrical laminates and fibers

For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.