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Semi-solid Epoxy Resins

EPON™ semi-solid epoxy resins bridge the processing gap between liquid and solid epoxy resins by offering:

Various levels of tack at room temperature
Pourability at slightly elevated temperatures
Intermediate time-to-hardness during cure

These semi-solid epoxy resins are most frequently used for:

Coatings--to improve flow and leveling
Adhesives--to achieve varying levels of tack
Prepregs--to achieve varying levels of tack

Product	Typical Properties			Description	Application
Product	Resin Type	Viscocity at 25^oC, cP	WPE, g./eq.	Description	Coatings	Construction	Composites	All Others⁽¹⁾
EPON Resin 834	Semi-solid BPA epoxy	2.1 - 2.4⁽²⁾	235 - 263	Epoxy with high amount of tack at room temperature
EPON Resin 836	Semi-solid BPA epoxy	315 - 670⁽³⁾	290 - 335	Slightly higher molecular weight than EPON Resin 834

HIGHLY RECOMMENDED:

¹ Other applications include adhesives, electrical castings, electrical laminates and fibers
² 40% wt. solution in methyl ethyl ketone
³ 75% wt. solution in methyl isobutyl ketone

For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.