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Solid Epoxy Resins

EPON™ Resin 1000 series resins are solid epoxy resins made via fusion with bisphenol A and are generally used in composites, baked industrial coatings, and the preparation of epoxy ester resins.

Medium to higher molecular weight grades are available, as well as both basic and sinter-resistant grades.

These solid resins can also be combined with other resins to impart unique melt viscosity characteristics to hot melt adhesives, molding powders, and powder coatings.

EPON solid epoxy resins provide end-products with:

High performance
High flexibility
Good abrasion resistance
Good corrosion resistance

Product	Typical Properties			Description	Application
Product	WPE, g./eq.	Viscocity at 25^oC, cP	Melt Point, ^oC	Description	Coatings	Construction	Composites	All Others⁽²⁾
EPON Resin 1001F	525 - 550	7.0 - 9.6	79	Lowest molecular weight solid epoxy resin. Susceptible to sintering.
EPON Resin 1002F	600 - 700	9.2 - 13.6	85	Slightly higher molecular weight than EPON Resin 1001F. Improved sintering resistance.
EPON Resin 1004F	800 - 950	15 - 25	96	Medium molecular weight solid epoxy resin.
EPON Resin 1007F	1700 - 2200	50 - 100	125	Moderately high molecular weight solid epoxy resin primarily for industrial coatings.
EPON Resin 1009F	2300 - 3800	100 - 250	135	High molecular weight primarily for baked coatings.

HIGHLY RECOMMENDED:

¹ 40% wt. solution in methyl ethyl ketone
² Other applications include adhesives, electrical castings, electrical laminates and fibers

For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.