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Our highly specialized, high-functionality epoxy resin systems can be formulated to meet customers' most stringent requirements for mechanical performance and endurance in composite and electronics adhesive applications.
Two-Component Epoxy/Amine Systems for Composites and Electronics
Epoxy Resin System | Performance & Features | |||
---|---|---|---|---|
Mechanical Properties | Adhesion | Cure Speed | Substrates | |
Solvent-free Systems | ||||
EPON Resin 8021 / EPIKURE Curing Agent 3271 | Metal, concrete, plastics, glass | |||
EPON Resin 8111 / EPIKURE Curing Agent 3270 / EPIKURE Curing Agent 3271 | Metal, concrete, plastics, glass | |||
For more information, speak with a Westlake Epoxy representative.