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Epoxy Preform Binders

Our preform binders offer numerous advantages for the mass production of composite parts. They have been designed for resin transfer and liquid compressing molding (RTM/LCM) processes and are compatible with the fast-curing epoxy resin matrices. The products provide stiffness for faster handling and positioning while preserving fabric permeability during injection and molding. 

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Preform Binders

EPIKOTETM Resin SystemsCuring Conditions
Time[min]Temp[oC]Glass Transition
Temp [°C] (DSC Midpoint)		Process Typical Applications 
EP 05390N.A.N.A.N.A.RTM LCMPower binder for parts made with liquid molding proceses
 Remarks:Reversible process of performing in the temp range of 80oC - 90oC. Very good processability during application. Very good compatibility with epoxy resin
EP TRAC 06720-31-10 min120oC - 170oCN.A.RTM LCMCross-linkable binder for parts made with liquid molding processes
 Remarks:Reversible process of performing in the temp range of 80oC - 90oC. Cross-links at a tempertaure of 100oC and above. Very good processability during application. Very good compatibility with epoxy resin
EP 05311N.A.N.A.N.A.RTM LCMPowder binder suitable for fabric stabilization during RTM injection.
 Remarks:Reversible process of performing in the temp range of 100oC - 110oC. Very good processability during application. Very good compatibility with epoxy resin
EPIKOTE Resin MGS PR 687GN.A.N.A.N.A.RTM
LCM 		Sprayed binder system for automated preforming
 Remarks: An epoxy tackifier (100% solids) developed to act as an adhesive during the reinforcement lay-up construction and preform production.
 
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