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Semi-solid Epoxy Resins

EPON™ semi-solid epoxy resins bridge the processing gap between liquid and solid epoxy resins by offering:

  • Various levels of tack at room temperature
  • Pourability at slightly elevated temperatures
  • Intermediate time-to-hardness during cure

These semi-solid epoxy resins are most frequently used for:

  • Coatings--to improve flow and leveling
  • Adhesives--to achieve varying levels of tack
  • Prepregs--to achieve varying levels of tack

ProductTypical PropertiesDescriptionApplication
Resin TypeViscocity at 25oC, cPWPE, g./eq.CoatingsConstructionCompositesAll Others(1)
EPON Resin 834Semi-solid BPA epoxy 2.1 - 2.4(2)235 - 263Epoxy with high amount of tack at room temperature
EPON Resin 836Semi-solid BPA epoxy 315 - 670(3)290 - 335Slightly higher molecular weight than EPON Resin 834

1 Other applications include adhesives, electrical castings, electrical laminates and fibers
2 40% wt. solution in methyl ethyl ketone
3 75% wt. solution in methyl isobutyl ketone

For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.

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